|
Today's Featured Biography
Robert Andosca
Robert is President and CEO of MicroGen Systems, and a Program Manager/Senior Scientist at the Infotonics Technology Center (ITC) both located near Rochester, NY. MicroGen and ITC have formed a strategic partnership to develop a MicroElectroMechanical Systems (MEMS) based piezoelectric vibrational energy harvester (PVEH) micro-power generator. These micro-generator devices will be used to power wireless sensor nodes (wireless sensor plus radio transmitter) distributed in a network to monitor an environment. These "smart" environnments could be automobiles (wireless airbag and tire pressure sensors), bridges (structural integrity), industrial and buildings (air flow, lighting control, equipment preventive maintenance), chemical and biological weapon detection, and many other applications.
Robert has over 19 years of professional experience in the design of engineering systems, MEMS and microelectronic industries. Prior to the IntelliSense spin-off he served as Technical Leader for Corning IntelliSense's Emerging Business Unit. This included several large engineering projects including 2D and 3D optical switches, RF capacitively coupled switches and a fluidic micronozzle chip. Two patents have been filed for optical switching technology.
Robert has also worked for other companies including Corning, Clare Corp., Lockheed Martin and Irvine Sensors Corporation. At Clare Corp. he worked as a project manager & engineer on several key products & processes. A micromachined dielectrically isolated fusion bonded SOI BiCDMOS IC product line & process was successfully designed and implemented into volume manufacturing. While with Clare he worked with The Massachusetts Institute of Technology developing a MEMS based micro-relay.
Robert worked for Irvine Sensors Corporation while in a partnership with IBM Microelectronics Division in Essex Jct., VT. In this position he helped develop and transfer 3D stacked 80 MB DRAM “cube” technology. This technology is now on the Hubble Space Telescope.
Robert performed his graduate studies at The University of Vermont in the Semiconductor Processing and Physical Acoustics laboratories. His Ph.D. research was on the development of a MEMS Lamb-wave acoustic microsensor with Dr. Junru Wu. He was awarded an SBIR grant through NSF/VT EPSCoR for the work. His M.S. degree was completed in a Materials Science interdisciplinary program between Electrical & Mechanical Engineering, Physics and Chemistry. He focused on VLSI microelectronics and Solid State Physics. His M.S. research was on the deposition of electronic materials at low temperatures using an Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor Deposition (ECR-PECVD) reactor.
Selected Grants / Patents / Publications:
“Back–grind GeOI Substrates up to 200mm Diameter,” G. Raskin, R. Andosca, M. Gabriel, M. Reiche, M. Firth, C. Franco, J. Dumas and P. Mijlemans, (Materials Research Society Proceedings, Symposium B, Spring Meeting 2004, April 12-16, San Francisco, CA).
U.S. Patent 10,053,844 “Tilting Mirror with Rapid Switching Time,” R. Andosca, J. Bernstein, I. Jafri, and G. Kirkos, filed January 2002.
U.S. Patent 10,099,153 “Electrostatically Actuated Microelectromechanical Devices and Method of Manufacture,” R.G. Andosca, filed December 19, 2001.
“MEMS Based Micro-relay,” N. Polce, R. Andosca, S. Jones, M. Schmidt, J. Lang and J. Wong, (Sensors Expo Proceedings, Chicago, Illinois, October 6-8, 1998) p. 397.
“Silicon Based Cap Chip for Stacked Memory,” T.G. Ference, R.G. Andosca and H.G. Linde, (IBM Bulletin, IBM internal publication, 1996).
NSF / VT-EPSCoR SBIR “Lamb-wave Micro-sensor Development,” R. Andosca, W. Varhue and J. Wu, 1994.
“Silicon Dioxide Prepared by Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor Deposition,” R.G. Andosca, W.J. Varhue and E. Adams, Journal of Applied Physics 72, 1126-1132 (1992).
VIEW ALL BIOGRAPHIES
|
Indicates an included photo
